{"id":"zource-legacy:Sheet1:r0055012","slug":"centerline-technologies-llc-r0055012","name":"Centerline Technologies, LLC","entityKind":"company","nativeName":null,"nativeLang":null,"aliases":[],"country":"United States","countryCode":"US","region":"global","wics":[],"wicsState":"unclassified","tier":0,"tierLabel":"unreviewed","completeness":0.71,"profileStatus":"qualified","indexEligible":true,"qualificationAnchors":["official_website"],"fieldState":{"description":"provided","website":"provided","headquartersCity":"not_provided","registryAnchors":"not_provided","tier":"provided","completeness":"provided"},"href":"/api/v1/companies/centerline-technologies-llc-r0055012","web":"/en/directory/centerline-technologies-llc-r0055012","hqCity":null,"founded":null,"website":"http://www.centerlinetech-usa.com/","ownership":null,"parent":null,"registryIds":[],"wikidataQid":null,"description":{"en":"Machining services including standard & back lapping, polishing, laser & diamond machining, diamond sawing & tumbling. Serving the telecommunication, semiconductor, communication, test & measurement, micro-electronic, defense and security i","zh":"描述未提供。"},"certifications":[],"markets":[],"attributes":[{"key":"canonical_country","unit":"US","label":"United States","value":"Q14"}],"provenance":{},"sourceCoverage":[],"createdAt":null,"updatedAt":"2026-09-07T01:50:19.016Z","news":[]}